Automation, defect reduction, repeatability, MES information management and simplified operation continue to be market drivers across all aspects of board assembly manufacturing. Electrovert’s patented Auto Exit Wing feature provides the level of automation that allows an automated adjustment of the laminar wave flow to match the board velocity for reduced defects. The recipe-controlled set-point ensures the wave dynamics are automatically adjusted ensuring wave flow dynamics are optimized for each PCB type and application.
Auto Exit Wing (English) – Brochure
Auto Exit Wing (Chinese) – Brochure
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ExactaWave is a patented, high-reliability sensor with closed-loop feedback designed to control the solder wave height relative to the board. Its ability withstand temperatures up to 300° (573°F) makes it perfectly suited for precision soldering applications.
The ExactaWave system compensates for changes in solder level, dross accumulation and set-up changes made during maintenance. Thus, a set-point entered in a recipe always produces the same result. The ExactaWave’s seamless integration into the soldering machine’s software also allows it to operate in standby mode and is a parameter that can be data logged with trending capability.
Electrovert’s Electra, VectraElite, and VectraES2 offer a wide range of features and capabilities that increase the value of the wave solder process. The value is achieved through reliability, features that provide process flexibility, maximize process control, and ultimately save time and money.
Value-based features include:
Electrovert’s flux flow monitor is intended for applications that flux flow verification is critical to the wave soldering process. The feature provides an accurate method of verifying repeatability of the flux flow rate and flux volume on a board-to-board basis. The flux flow monitor uses an innovative non-contact type sensor. This approach allows the feature to be compatible across a broad range of flux types and spray technologies.
Flux Flow Monitor Features:
Flux Flow Monitor – Brochure
Electrovert’s full nitrogen tunnel feature includes all the same features and benefits of the short tunnel plus a fully inerted preheat section. The innovative approach to inerting the preheat section allows for forced convection preheat in preheat location #1 (closest to solder) and in both upper/lower positions.
Benefits of the nitrogen tunnel include:
Electrovert’s quick change solder pot allows the use of two or more alloys with easy change-over of interchangeable solder pots. This feature is designed for safety, beginning with a robust cart that includes locking devices and safety bars to secure the pot. The quick-change electrical and nitrogen utilities simplify change-over while the warming station (included) significantly reduces changeover time.
Quick-change pot benefits include:
The ServoJet system ensures thorough flux penetration by utilizing concentric air atomization. It offers a programmable method of applying flux that results in consistent flux deposition and reduced flux usage. The ServoJet utilizes air atomized multiple jet technology that is 100% integrated into the wave soldering system software. [servojet]
High end fluxer capabilities include:
ServoJet benefits include:
The ServoSonic is a reciprocating ultrasonic atomizing spray fluxing system. It consists of an ultrasonic atomized spray nozzle and air impact nozzle with an automatic self-cleaning function. The titanium nozzle and horn assemblies make the ServoSonic an ideal solution for high solids and aggressive water soluble fluxes.
The ServoSonic benefits include:
ServoSpray provides an ideal balance between system performance, functionality and low cost of ownership. ServoSpray has the ability to spray in one or both directions, includes self-clean capability, and features a pressure tank flux supply system. ServoSpray utilizes atomized air delivery technology and is 100% integrated into the wave solder machine software.
ServoSpray benefits include:
Electrovert’s nitrogen tunnel utilizes patented technology that inerts at the solder wave area only. This efficient approach maintains a very low oxygen environment of <50 ppm which is ideal for increased wetting effects and a significant reduction of dross.
Benefits of the nitrogen tunnel include:
The patented UltraFill 4.0 solder nozzle is an ideal solution for lead-free soldering. The UltraFill 4.0 nozzle is 40% wider than traditional tin-lead nozzle to increase contact time. The nozzle placement reduces the temperature drop between nozzles and improves hole fill. UltraFill allows either air or nitrogen operation through the same design without switching nozzles. Nitrogen or air operation can be selected through the desired recipe, without the need to change nozzles (also available with the rotary chip nozzle).
