The Momentum® II 100 stencil printer is a hard-working, value-priced machine utilizing the robust, reliable Momentum series printer proven in top facilities around the world. Featuring a modest footprint that can grow with the user: add or retrofit innovative, patented features as throughput demands grow.
Alignment repeatability of ±11 microns @ 6 sigma, Cpk ≥2 and wet Print accuracy of 20µm@6σ, Cpk ≥ 2, with 6σ capability designed in and independently verified. The Momentum II series stencil printers are fast, precise, and highly reliable, with performance unmatched by any other printer in their class.
The Momentum II 100 is a space-saving 200 mm shorter than the standard Momentum II stencil printer platform. Configured for Back-to-Back (BTB) processing, for example, two individual printers back to back in a manufacturing line enables dual-lane processing with the combined output of two machines, but in the line length of one.
The Momentum II 100 is designed for total front-side accessibility for simplified service to the electrical system, access to the solvent reservoir, and more. Without the need for rear access space, adjacent BTB machines help you make the most of every inch of your floor space.
Accurate and repeatable performance delivers quality products with fewer defects. The reasonable cost of ownership for the Momentum II 100 printer ensures you’ll see a faster ROI, and higher profitability going forward.
AccuCheck Print Capability Verification allows the printer to measure its own print capability. Users can verify the machine’s capability at any time or continuously on their own products. AccuCheck measures the actual print deposit position versus the target pad to determine a measured print offset. It is an inexpensive, reliable method of obtaining machine quality and process capability information to ensure repeatable results and optimum printing performance.
Provides the flexibility to handle all stencil sizes with a simple adjustment of the shelf. The robust design provides better stability on all stencil sizes.
Dispense for standard cartridges or choose the new patent-pending jar dispenser. Paste is released in precise, measured amounts across the stencil in a clean, uniform bead. Deposition volumes, frequency and placement are user programmable.
Easy to learn and use for the average operator, MPM’s Benchmark software is powerful yet intuitive, and facilitates rapid setup, assists with operational tasks, and makes changeover quick and easy. The software has been upgraded to Windows 10 and new production tools and new Quickstart programming to make it even easier to use.
The EdgeLoc system uses a side snugging technique that removes the need for top clamps which interfere with the PCB to stencil contact. The result is optimal gasketing and more volumetrically consistent edge-to-edge prints. Choose the robust EdgeLoc II with side only clamping or EdgeLoc+ which can change between edge and top clamping;
The High Flow Venturi System with closed-loop control represents a major advancement, blending digital programmability with exceptional flexibility and simplicity in setup. Its precise programmability, adaptability to different substrate thicknesses, and focus on maintaining quality consistency make it an invaluable asset for boosting productivity and yield.
High Flow Venturi – Video (English)
High Flow Venturi video – Video (Chinese)
MPM’s OpenApps is an open architecture source code which provides the capability of developing custom interfaces in support of Industry 4.0 initiatives and communication with Manufacturing Execution Systems (MES). ITW EAE is the first SMT company to offer open software architecture.
The Paste Height Monitor is designed to prevent defects caused y inadequate volumes of paste on the stencil. It combines advanced software and sensor technology to accurately monitor the paste bead for volume consistency. Upper and lower limit roll-height monitoring eliminates insufficient or excess paste volumes. It is a non-contact solution that can automatically add more paste to the stencil as it is needed.
Temperature monitoring ensures proper paste viscosity to avoid bridging and voiding. MPM patent- pending paste temperature monitor allows paste to be measured in the cartridge or on the stencil.
The PrinTrack feature adds traceability, data harvesting, and reporting to your printing process. With PrinTrack, you always have an easy access to a comprehensive history, detailing:
A flexible web reporting interface can be user-configured to produce traceability reports.
New quick release squeegee blades make changing blades quick and easy with no tools required. It takes less than 30 seconds to change the blade.
SPI Print Optimizer brings your Solder Paste Inspection (SPI) machine into communication with your MPM printer through a specially-developed common interface. When the SPI machine ‘sees’ X, Y and theta offset problems on a just-printed PCB, it analyzes the data virtually instantly and gives the printer instructions to correct those offsets, automatically, and ‘on the fly’.
MPM’s patented printe rbased Vision and Inspection system is a cost-effective way to verify print and paste deposit results. It is flexible enough to handle the complete range of today’s most challenging components. This system measures the amount of paste covering the target pad and compares it with the required coverage. 2D inspection is integrated directly into the stencil printer to provide an immediate source of data.
