This paper will focus on the requirements needed to implement a central database for printer recipes and minimize setup time required to begin production. The SMT process works best the more we minimize the human…
View MorePaste-in-Hole (PIH) printing, a.k.a. through-hole printing, pin-in-paste, intrusive reflow, etc., has always been a way to accommodate traditional through-hole components on a mixed-technology SMT assembly using reflow soldering rather than wave to make the through-hole…
View MoreIncreasingly fine pitch component patterns on PCBs, and ever-smaller passive components such as 03015’s continue to narrow the process window for PCB assemblers. The drive toward ever-finer pitches is driven by a number of factors,…
View MoreStencil printing is a critical first step in surface mount assembly. It is often cited that the solder paste printing operation causes about 50%-80% of the defects found in the assembly of PCBs. Printing is…
View MoreStencil printing technology has come a long way since the early 80’s when SMT process gained importance in the electronics packaging industry. In those early days, components were fairly large, making the board design and…
View MoreFine pitch/fine feature solder paste printing in PCB assembly has become increasingly difficult as board geometries have become ever more compact. The printing process itself, traditionally the source of 70% of all assembly defects, finds…
View MoreStencil printing today requires a higher degree of printer accuracy than ever before. Printer accuracy becomes increasingly difficult to maintain as demands for higher speeds and throughput test the limits of a printer’s capabilities, particularly…
View MoreProcess traceability and verification has become increasingly important as electronics assembly has moved to higher throughputs and volume requirements with tighter process windows. Ensuring repeatable, high yields requires an optimized process that is constantly in…
View MoreIn simplest terms, a faster printer logically means higher throughput. Overall speed, however, is dependent upon a number of factors including the individual cycle times for various steps in the print cycle (e.g., stencil wiping…
View MoreThe techniques described have proven to be robust and particularly well suited for detecting troublesome bridge and bridge-like features that span the gap between pads. This paper describes part of a research effort currently under…
View MoreThis paper will focus on the application requirements of solder printing small aperture designs, concentrating on 008004 (inch) / 0201 (metric) size components, and the results of a design of experiment printing these challenging apertures.…
View MoreUnder stencil wiping is the first defense against defects. Matching the wiper profile and frequency to the individual boards, where one size does not fit all.
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