Automation, defect reduction, repeatability, MES information management and simplified operation continue to be market drivers across all aspects of board assembly manufacturing. Electrovert’s patented Auto Exit Wing feature provides the level of automation that allows an automated adjustment of the laminar wave flow to match the board velocity for reduced defects. The recipe-controlled set-point ensures the wave dynamics are automatically adjusted ensuring wave flow dynamics are optimized for each PCB type and application.
Auto Exit Wing (English) – Brochure
Auto Exit Wing (Chinese) – Brochure
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The Deep Wave option innovative system provides the ability to pump up to 20 mm wave height.
The Deep Wave option overcomes the challenges associated with deep pockets and masking and provides a wave depth necessary to achieve topside hole fill. In some applications the 20 mm capability has removed the need for an additional soldering process. The Deep Wave is a recipe-controlled parameter in the machine software that can make changes between different wave heights within 10 seconds. The Deep Wave option complements other Electrovert value added options including ExactaWave (automatic wave height adjustment), adjustable wave pump RPM’s settings, forced convection blower speed adjustments and precision selective fluxing that can all be adjusted on-the-fly.
Deep Wave – Brochure
The DwellFlex 4.0 is the first solder nozzle designed specifically with Industry 4.0 automation in mind. The patented design enables the length of the wave to be adjusted on-the-fly as variable board types are run through the wave. This ensures solder contact time is optimized for a high-mix of board types without changing conveyor speeds.
The DwellFlex 4.0 provides the highest level of soldering capability for thermally challenging and difficult solder applications. The single wave design at maximum opening delivers the most thermal energy and longest dwell time in the industry.
The DwellFlex 4.0 benefits include:
Click here to watch the DwellFlex 4.0 video
DwellFlex 4.0 – Brochure
DwellMax 4.0 is a patented process solution that meets the challenges of lead-free wave soldering. The extra-wide chip nozzle and modified UltraFill 4.0 nozzle are ideal for soldering thick, high thermal mass circuit boards, increasing throughput capability. With conventional wave soldering technology, thick multi-layer and/or high thermal mass circuit boards are often accompanied by high cost from low yields, slow production speeds, rework costs, and the collateral damage associated with a rework loop. The innovative design of DwellMax 4.0 alleviates these problems and provides better PTH fill at significantly faster conveyor speeds. The benefits of the nitrogen tunnel include improved solder wetting and reduction in dross by up to 83%.
DwellMax 4.0 benefits include:
Electrovert’s DwellMax 4.0 is the key to a better bottom line through fewer defects and maximized productivity.
EcoWave™ is the smarter, more sustainable future of wave soldering—delivering significant dross reduction, lower operating costs, and superior soldering performance. By combining Electrovert’s advanced DwellFlex™ 4.0 and Auto Exit Wing™ technologies, EcoWave enhances product quality, increases process flexibility, and supports environmental goals without adding nitrogen consumption.
EcoWave (English) – Brochure
ExactaWave is a patented, high-reliability sensor with closed-loop feedback designed to control the solder wave height relative to the board. Its ability withstand temperatures up to 300° (573°F) makes it perfectly suited for precision soldering applications.
The ExactaWave system compensates for changes in solder level, dross accumulation and set-up changes made during maintenance. Thus, a set-point entered in a recipe always produces the same result. The ExactaWave’s seamless integration into the soldering machine’s software also allows it to operate in standby mode and is a parameter that can be data logged with trending capability.
Electrovert’s Electra, VectraElite, and VectraES2 offer a wide range of features and capabilities that increase the value of the wave solder process. The value is achieved through reliability, features that provide process flexibility, maximize process control, and ultimately save time and money.
Value-based features include:
Maximize production efficiency and protect your PCBs with Electrovert’s Finger Crash Detect option. This advanced feature continuously monitors conveyor fingers and identifies bent fingers before boards enter the process area helping avoid misalignment, defects, and downtime. Fully integrated with machine software, it alerts operators instantly and pinpoints the exact location for fast replacement. Built for both standard and heavy-duty conveyors, this durable, field-upgradeable solution combines stainless steel construction with high-temperature sensors for long-lasting performance. Smarter detection. Faster recovery. Greater uptime.
Finger Crash Detect – Brochure
Electrovert’s flux flow monitor is intended for applications that flux flow verification is critical to the wave soldering process. The feature provides an accurate method of verifying repeatability of the flux flow rate and flux volume on a board-to-board basis. The flux flow monitor uses an innovative non-contact type sensor. This approach allows the feature to be compatible across a broad range of flux types and spray technologies.
Flux Flow Monitor Features:
Flux Flow Monitor – Brochure
Electrovert’s full nitrogen tunnel feature includes all the same features and benefits of the short tunnel plus a fully inerted preheat section. The innovative approach to inerting the preheat section allows for forced convection preheat in preheat location #1 (closest to solder) and in both upper/lower positions.
Benefits of the nitrogen tunnel include:
The Heavy Duty Conveyor is designed to handle heavier loads of up to 91 kg (200 lb) while still maintaining the benefits of a single continuous conveyor. The use of titanium universal V/L fingers with a choice of 3mm or 6mm L, along with precision linear bearing support cross shafts and fine-pitch screw shafts are robust with excellent parallelism for the conveyor. The high-strength hard-coat anodized aluminum extrusion used in the rail and tunnel support structure are field proven in demanding production environments for its durability and stability.
Electrovert’s quick change solder pot allows the use of two or more alloys with easy change-over of interchangeable solder pots. This feature is designed for safety, beginning with a robust cart that includes locking devices and safety bars to secure the pot. The quick-change electrical and nitrogen utilities simplify change-over while the warming station (included) significantly reduces changeover time.
Quick-change pot benefits include:
The ServoJet system ensures thorough flux penetration by utilizing concentric air atomization. It offers a programmable method of applying flux that results in consistent flux deposition and reduced flux usage. The ServoJet utilizes air atomized multiple jet technology that is 100% integrated into the wave soldering system software. [servojet]
High end fluxer capabilities include:
ServoJet benefits include:
The ServoSonic is a reciprocating ultrasonic atomizing spray fluxing system. It consists of an ultrasonic atomized spray nozzle and air impact nozzle with an automatic self-cleaning function. The titanium nozzle and horn assemblies make the ServoSonic an ideal solution for high solids and aggressive water soluble fluxes.
The ServoSonic benefits include:
ServoSpray provides an ideal balance between system performance, functionality and low cost of ownership. ServoSpray has the ability to spray in one or both directions, includes self-clean capability, and features a pressure tank flux supply system. ServoSpray utilizes atomized air delivery technology and is 100% integrated into the wave solder machine software.
ServoSpray benefits include:
Electrovert’s nitrogen tunnel utilizes patented technology that inerts at the solder wave area only. This efficient approach maintains a very low oxygen environment of <50 ppm which is ideal for increased wetting effects and a significant reduction of dross.
Benefits of the nitrogen tunnel include:
The patented UltraFill 4.0 solder nozzle is an ideal solution for lead-free soldering. The UltraFill 4.0 nozzle is 40% wider than traditional tin-lead nozzle to increase contact time. The nozzle placement reduces the temperature drop between nozzles and improves hole fill. UltraFill allows either air or nitrogen operation through the same design without switching nozzles. Nitrogen or air operation can be selected through the desired recipe, without the need to change nozzles (also available with the rotary chip nozzle).
