Technical Papers

Reflow Soldering of PCB Components with Mixed Thermal Mass

Growth of electrical vehicles and 5G technologies may impact the landscape of soldering equipment used for printed circuit board (PCB) assemblies. These applications require large multi-layer PCBs that contain small surface mounted devices (SMD) together…

Reliability Threats Fine Pitch Through Hole Soldering

Miniaturization continues in all kind of electronic assemblies and thus also in the different soldering processes. Not only consumer electronic assemblies become smaller, but also in other areas like automotive, industrial and medical parts reduce…

Effective Methods to Get Volatile Compounds Out of Reflow Process

Although reflow ovens may not have been dramatically changed during the last decade the reflow process changes step by step. With the introduction of lead-free soldering not only operation temperatures increased, but also the chemistry…

Oxygen Doping or Closed Loop Controlled Nitrogen in Reflow Oven

An inert atmosphere opens the reflow process window. Reflow ovens that have a Nitrogen environment may have better yields because of the lack of oxidation during the process. The wetting properties are improved due to…