The use of high velocity, heated air to remove residual water has become the predominant method for drying printed circuit boards in the in-line aqueous cleaning process. As lead-free circuit boards become more complex and component…
View MoreAssemblers surveyed report that cleaning misprinted circuit assemblies is a production gap that has not been adequately addressed. Traditionally, the industry has used stencil cleaning agents and equipment to address this rework need. One of…
View MoreNo-clean pastes have specific physical properties, which directly impact industry standard electronic assembly cleaning processes. This paper sets out to establish new benchmarks for cleaning no clean surface mount solder paste residues (including the most…
View MoreCleaning electronic assemblies, or PCBs (Printed Circuit Boards), has been essential for many years. As PCB board density has increased and standoff height has decreased, so have cleaning challenges. Numerous technical studies published over the…
View MoreAs the electronics industry moves toward the implementation of Pb-free soldering, the impact on the assembly process must be considered. One process that is often over looked is the cleaning of assembled printed circuit boards.…
View MoreMoore’s Law infers that the number of transistors on a chip doubles approximately every two years. Consistent with Moore’s Law, high reliability electronic devices build faster processing speed and memory capacity using increasing smaller platforms.…
View MoreMost board assemblers strive to optimize their cleaning process to provide the best cleaning performance over a broad range of board assemblies. This paper presents the results from a designed experiment on fluid dynamics across…
View MoreAssemblers surveyed report that cleaning misprinted circuit assemblies is a production gap that has not been adequately addressed. Traditionally, the industry has used stencil cleaning agents and equipment to address this rework need. One of…
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